Conductivity Type: | P-Type |
---|---|
Purity: | EG-Si |
Type: | Monocrystalline Silicon |
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Silicon infrared window, Square silicon wafer, silicon strip, sputtering target material,Microporous target material, Small diameter infrared lens, reflective lens, Circular target...
Application:
Silicon targets are used in the manufacture of semiconductor devices (such as wafers, solar cells), optical thin films, silicide ceramics, anti-reflective coatings and nanostructured materials. Its high purity and good physical properties make it widely used. Silicon targets show important applications in many fields due to their excellent physical and chemical properties. Not only can it be used to manufacture high-precision semiconductor devices, such as key layers in integrated circuits and microprocessors, but it is also a key material for improving conversion efficiency in solar panels. In addition, in the field of optics, silicon targets can prepare high-performance optical films and enhance the performance of optical devices.
Silicon ingot is the raw material of silicon target, which needs crystal growth.
Silicon ingots usually use the Czochralski growth method, that is, silicon ingots are put into a high-temperature molten silicon melt, and then gradually grow into cuboid crystals by rotating and stretching. This process requires strict control of factors such as temperature, drawing speed and atmosphere to ensure the quality and purity of the crystal.
Processing:
Silicon Crystal selection is a key step in silicon target production. In the process of crystal selection, tungsten wire is used to heat the silicon block, so that it is melted and cooled to crystallize. Then, according to the required crystal site, Raman strength, the selection and separation of the product. The quality and grade selection and control are the key factors affecting the quality of silicon target.
After crystal selection, the silicon block is cut and finished to obtain the silicon target. Processing includes finishing, grinding, polishing and other processes, requiring the use of high-precision equipment and high-quality abrasives and chemicals.
The above is the main step of silicon target production, and the production process requires fine control of various parameters to ensure the stability and reliability of silicon target quality