Semiconductor Mono-Crystal X-ray Orientation Unit for Seed Crystal Testing

• After-sales Service: 7*24hours
• Portable: Non Portable
• Form: Flatbed
• Model NO.: FW-instruments
• Application: Industrial
• Type: Industrial High-definition X-ray Detector
• Certification: ISO
• Customized: Customized
• Application1: Semiconductor Manufacturing
• Key Components: X-ray Goniometer
• Transport Package: Wood
• Trademark: FineWin
• Origin: China

Product Description

Product Description

what is X-Ray Orientation Unit & Application

A Semiconductor Mono-Crystal X-Ray Orientation Unit is a specialized instrument used to determine the precise crystallographic orientation of single-crystal semiconductor wafers, typically silicon, germanium, or gallium arsenide. This is crucial because the crystal orientation significantly impacts the properties and performance of semiconductor devices. The unit utilizes X-ray diffraction techniques to analyze the crystal structure and determine the orientation with high accuracy, often within a few angular seconds. 

Applications:
Semiconductor Manufacturing:
Ensuring proper crystal orientation is critical for fabricating high-performance transistors, diodes, and other semiconductor components.  
Material Science Research:
Studying the relationship between crystal orientation and material properties.  
Quality Control:
Verifying the orientation of wafers during production to ensure consistency and quality.  
Research and Development:
Exploring new materials and processes that rely on specific crystal orientations.  
 

DXB-S7BG Manualmeasurement of ingots/wafers

7B(G)/7A(G)/WSerial
• The Equipment is a Double-work bench.

• Measurement of the angle in the direction of the end face or reference edge of the wafer/ingot.

• Manually operated measurements, manual judgement of peaks.

• Variety of other sample stages are available, suitable for special size crystals, and special measurement requirements.

7BN (G) /7AN(G)Serial

• The Equipment is a Double-work bench.

• Measurement of the angle of the end face or NOTCH crystal direction of the ingots/wafer.

• Manually operated measurements, manual judgement of peaks.

Equipment Pertormance

• Supports multi-angle orientation.(θ:0~50°)

• Automatic positioning of X-ray focus height.

• The equipment is equipped with a rotating worktable, which allows the crystal under test to rotate and orient 360°.

• Calibration-free, no need for daily equipment calibration.

• Selective touch screen operation simplifies input conditions and reduces misoperation rates.

• The crystal after end face grinding can also be re-inspected.

Specification

Item	Specifications(8BD600AG)	Specifications(8BD800AG)
Crystal Specifications	Crystal Balls/ ingots up to 200kg	Crystal Balls/ ingots up to 450kg
Measuring space (with fixtures and crystals)	MAX:600(Inches)X500(High)mm	largest:800(Inches)X750(High)mm
Measurement angle	0~50°	0~50°
Accuracy	±30″	±30″