Best Quality N Type Silicon Wafer for Sale From China Factory Suppliers

• Application: LED
• Type: Intrinsic Semiconductor
• Growth Method: CZ and Fz
• Model NO.: FW-Silicon
• Orientation: 111 or 100
• Resistivity: 0.0005 to 150
• Surface: Double Side Polished or Single Side Polished
• Dopant: N Type and P Type
• Particles: <30 at 0.3um
• Bow: < 30 Um
• Ttv: <15 Um
• Manufacturing Technology: Optoelectronic Semiconductor
• Material: Compound Semiconductor
• Package: SMD
• Signal Processing: Analog Digital Composite and Function
• Transport Package: Box
• Specification: customized
• Trademark: Finewin
• Origin: China
• Production Capacity: 100, 000PCS/Month
• Package Size: 25.00cm * 44.00cm * 50.00cm
• Package Gross Weight: 3.000kg

Product Description

 Best Quality N type Silicon Wafer for Sale from China Factory Suppliers

 

Product Description

1. what is silicon wafers and it's application:
The silicon wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit.

A silicon wafer is a material essential for manufacturing semiconductors, which are found in all kinds of electronic devices that enrich our lives.
Few of us have a chance to encounter an actual silicon wafer in daily life. This ultra-flat disk is polished to a mirror-like surface, and made as free as possible of tiny surface irregularities, making it the flattest object in the world. It is also ultra-clean, virtually free of microparticles and other impurities. These qualities are necessary so it can be used as the substrate material of today's state-of-the-art semiconductors.

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Related products we can supply

processing

Growing a silicon ingot can take anywhere from one week to one month, depending on many factors, including size, quality and the specification. More than 75% of all single crystal silicon wafers grow via the Czochralski (CZ) method. 

 

Equipments

Product Parameters

Growth Method	CZ
Type(doping)	P-type (B doped) or Ntype (P doped)
Orientation	(100) or (111)
Diameter	2inch~12inch
Thickness	200~1500 μm,
Surface	SSP or DSP
TTV&BOW	'≤15 μm
Resistivity	0~300ohm.cm
Cleaning/ packaging	Vacuum packaging, 25 pieces in one cassette packaging
Stock situation	your required specification can be sent to us for checking

5.FAQ:

Q: What's the way of shipping and cost?

A:(1) We accept DHL, Fedex, TNT, UPS, EMS etc.

   (2) If you have your own express account, it's great.If not,we could help you ship them. 

 Q: How to pay?

A: T/T, Paypal, etc

Q: What's your MOQ?

A:  (1) For inventory, the MOQ is 5pcs.

   (2) For customized products, the MOQ is 10pcs-25pcs.

Q: What's the delivery time?

A:  (1) For the standard products

          For inventory: the delivery is 5 workdays after you place the order.

          For customized products: the delivery is 2 or 3 weeks after you place the order.

     (2) For the special-shaped products, the delivery is 4 or 6 workweeks after you place the order.

Q: Do you have standard products?

A: Our standard products in stock.

Q: Can I customize the products based on my need?

A: Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.