4" Silicon Wafers for Power Semiconductor Devices

Product Details
Growth Method: CZ, Fz
Dopant: P-Type, Boron
Orientation: 111 or 100
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  • 4" Silicon Wafers for Power Semiconductor Devices
  • 4" Silicon Wafers for Power Semiconductor Devices
  • 4" Silicon Wafers for Power Semiconductor Devices
  • 4" Silicon Wafers for Power Semiconductor Devices
  • 4" Silicon Wafers for Power Semiconductor Devices
  • 4" Silicon Wafers for Power Semiconductor Devices
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  • Overview
  • Product Description
  • Detailed Photos
  • Related products we can supply
  • processing
  • Equipments
  • Product Parameters
Overview

Basic Info.

Model NO.
FW-CRYSTAL
Resistivity
1-15ohm * Cm
Surface
Ssp or DSP
Manufacturing Technology
Optoelectronic Semiconductor
Material
Compound Semiconductor
Type
Intrinsic Semiconductor
Package
SMD
Signal Processing
Analog Digital Composite and Function
Application
LED
Transport Package
Box
Specification
4inch ntype
Trademark
FW
Origin
China

Packaging & Delivery

Package Size
25.00cm * 55.00cm * 50.00cm
Package Gross Weight
3.000kg

Product Description

Product Description

Silicon Substrates

1. what is silicon wafers and it's application:

A silicon wafer is a material essential for manufacturing semiconductors, which are found in all kinds of electronic devices that enrich our lives.

Silicon wafer is the most common material and widely used for a varity of high-tech industries, including integrated circuits, detector or sensor device, MEMS fabrication, opto-electronic components, and solar cells.
Detailed Photos

4" Silicon Wafers for Power Semiconductor Devices4" Silicon Wafers for Power Semiconductor Devices

Related products we can supply

4" Silicon Wafers for Power Semiconductor Devices4" Silicon Wafers for Power Semiconductor Devices


processing

Manufacturing a Silicon Wafer
Growing a silicon ingot can take anywhere from one week to one month, depending on many factors, including size, quality and the specification. More than 75% of all single crystal silicon wafers grow via the Czochralski (CZ) method. 

4" Silicon Wafers for Power Semiconductor Devices

 

Equipments



4" Silicon Wafers for Power Semiconductor Devices

Product Parameters
 
Grow method CZ or FZ
Diameter 1 to 8 inch
Finish As cut, lapped, etched, SSP, DSP
Orientation (100) (111) (110)
Type N or P
Resistivity CZ: From 0.0005 to 150 Ωcm
FZ: Up to 10 kΩcm

 

 

5.FAQ:

Q: What's the way of shipping and cost?

A:(1) We accept DHL, Fedex, TNT, UPS, EMS etc.

   (2) If you have your own express account, it's great.If not,we could help you ship them. 

 Q: How to pay?

A: T/T, Paypal, etc

Q: What's your MOQ?

A:  (1) For inventory, the MOQ is 5pcs.

   (2) For customized products, the MOQ is 10pcs-25pcs.

Q: What's the delivery time?

A:  (1) For the standard products

          For inventory: the delivery is 5 workdays after you place the order.

          For customized products: the delivery is 2 or 3 weeks after you place the order.

     (2) For the special-shaped products, the delivery is 4 or 6 workweeks after you place the order.

Q: Do you have standard products?

A: Our standard products in stock.

Q: Can I customize the products based on my need?

A: Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.



 

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