Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon

Product Details
Application: LED
Batch Number: Polished
Manufacturing Technology: Optoelectronic Semiconductor
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  • Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon
  • Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon
  • Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon
  • Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon
  • Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon
  • Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon
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Basic Info.

Model NO.
FW-LN
Material
Compound Semiconductor
Model
1324
Package
SMD
Signal Processing
Analog Digital Composite and Function
Type
Intrinsic Semiconductor
Growth Method
CZ and Fz
Orientation
111 or 100
Resistivity
0.0005 to 150
Surface
Double Side Polished or Single Side Polished
Dopant
N Type and P Type
Particles
<30 at 0.3um
Bow
< 30 Um
Ttv
<15 Um
Brand
Finewen
Transport Package
Box
Specification
customized size
Trademark
FW-Wafers
Origin
Jiaozuo Henan
Production Capacity
100, 000PCS/Month

Product Description

Customized high-grade Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon 


1. what is Oxide silicon wafers and it's application:
The silicon thermal dioxide wafer refers to the thermal growth of a uniform dielectric film on the surface of the silicon wafer, which is used as an insulation or mask material. The oxidation process includes high temperature dry oxygen oxidation and high temperature wet oxygen oxidation.
Customized Laser Cutting P Type N Type 8 Inch Soi Wafer SiliconCustomized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon
2.Product discriptio
Product Name
6 Inch Diameter 150mm T2500um+-25um/2.5mm Thickness Single Surface Polished 47.5mm Flat Silicon Wafers Silicon wafer
Material
Silicon
Diameter 
150mm
Surface finish
SSP
Orientation
NO Request
Grade
None
Type
None
Resistivity
None
Thickness
2500um
3. Manufacturing a Silicon Wafer
Growing a silicon ingot can take anywhere from one week to one month, depending on many factors, including size, quality and the specification. More than 75% of all single crystal silicon wafers grow via the Czochralski (CZ) method. 

Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon

4.Equipment we use

Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon

5.Spcifications(related products we can supply)
Customized Laser Cutting P Type N Type 8 Inch Soi Wafer Silicon
6.FAQ:

Q: What's the way of shipping and cost?

A:(1) We accept DHL, Fedex, TNT, UPS, EMS etc.

   (2) If you have your own express account, it's great.If not,we could help you ship them. 

 Q: How to pay?

A: T/T, Paypal, etc

Q: What's your MOQ?

A:  (1) For inventory, the MOQ is 5pcs.

   (2) For customized products, the MOQ is 10pcs-25pcs.

Q: What's the delivery time?

A:  (1) For the standard products

          For inventory: the delivery is 5 workdays after you place the order.

          For customized products: the delivery is 2 or 3 weeks after you place the order.

     (2) For the special-shaped products, the delivery is 4 or 6 workweeks after you place the order.

Q: Do you have standard products?

A: Our standard products in stock.

Q: Can I customize the products based on my need?

A: Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.
 



 

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