Materials: | Gallium Nitride |
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Thickness: | 3-4um or 20um |
Size: | 2inch or 4inch |
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XRD-FWHM | 002 | 102 |
3-4μm GaN/Sapphire | 200-300 | 250-450 |
Item | GaN-FS-C-U-C50 | GaN-FS-C-N-C50 | GaN-FS-C-SI-C50 |
Dimensions | Ф 50.8 mm ± 1 mm | ||
Thickness | 350 ± 25 µm | ||
Useable Surface Area | > 90% | ||
Orientation | C-plane (0001) off angle toward M-Axis 0.35°± 0.15° | ||
Orientation Flat | (1-100) ± 0.5°, 16.0 ± 1.0 mm | ||
Secondary Orientation Flat | (11-20) ± 3°, 8.0 ± 1.0 mm | ||
Total Thickness Variation | ≤ 15 µm | ||
BOW | ≤ 20 µm | ||
Conduction Type | N-type (Undoped) |
N-type (Ge-doped) |
Semi-Insulating (Fe-doped) |
Resistivity(300K) | < 0.5 Ω·cm | < 0.05 Ω·cm | >106 Ω·cm |
Dislocation Density | 1~9x105 cm-2 | 5x105 cm-2 ~3x106 cm-2 |
1~9x105 cm-2 |
1~3x106 cm-2 | 1~3x106 cm-2 | ||
Polishing | Front Surface: Ra < 0.2 nm. Epi-ready polished Back Surface: Fine ground |
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Package | Packaged in a class 100 clean room environment, in single wafer containers, under a nitrogen atmosphere. |
Item | GaN-T-C-U-C100 | GaN-T-C-N-C100 |
Dimensions | Ф 100 mm ± 0.1 mm | |
Thickness | 4 µm, 20 µm | |
Orientation | C-plane(0001) ± 0.5° | |
Conduction Type | N-type (Undoped) |
N-type (Si-doped) |
Resistivity 300K | < 0.5 Ω·cm | < 0.05 Ω·cm |
Carrier Concentration | < 5x1017 cm-3 | > 1x1018 cm-3 |
Mobility | ~ 300cm2/V·s | ~ 200 cm2/V·s |
Dislocation Density | Less than 5x108 cm-2 | |
Substrate structure | GaN on Sapphire(Standard: SSP Option: DSP) | |
Useable Surface Area | > 90% | |
Package | Packaged in a class 100 clean room environment, in cassettes of 25pcs or single wafer containers, under a nitrogen atmosphere. |