GaN Template Wafers Substrate for High-Power Device

Product Details
Materials: Gallium Nitride
Thickness: 3-4um or 20um
Size: 2inch or 4inch
Gold Member Since 2018

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  • GaN Template Wafers Substrate for High-Power Device
  • GaN Template Wafers Substrate for High-Power Device
  • GaN Template Wafers Substrate for High-Power Device
  • GaN Template Wafers Substrate for High-Power Device
  • GaN Template Wafers Substrate for High-Power Device
  • GaN Template Wafers Substrate for High-Power Device
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Basic Info.

Model NO.
FW-CRYSTAL
Manufacturing Technology
Optoelectronic Semiconductor
Material
Compound Semiconductor
Type
N-type Semiconductor
Package
SMD
Application
Television
Brand
Finewin
Transport Package
Box
Specification
2INCH
Trademark
FineWin
Origin
Jiaozuo City Henan Province
Production Capacity
1000 PCS/Month

Product Description

GaN Template Wafers

1. What is templates
We use the term "template" to describe our products as they are different to substrates. Specifically, a template is a composite or engineered substrate, where one or more layers are added to the original susbstrate.

2.Application
 
Blue and white LED for room lightings, displays and general use

GaN power switching devices

3.Product available

2" to 4" GaN-templates on FSS and PSS
Thick GaN-templates (t=3~20μm)
GaN-template with highly doped n-type layer (n=<1e19/cm3)
Ntype (undoped), Ntype (Si doped), and Ptype(Mg doped) templates are available
GaN Templates on both sapphire substres and Silicon substrates

4. Features
XRD-FWHM 002 102
3-4μGaN/Sapphire 200-300 250-450
GaN Template Wafers Substrate for High-Power Device

 Dislocation density:3.5E+08 cm-2



5. Specification
2inch specification
Item GaN-FS-C-U-C50 GaN-FS-C-N-C50 GaN-FS-C-SI-C50
Dimensions Ф 50.8 mm ± 1 mm
Thickness 350 ± 25 µm
Useable Surface Area > 90%
Orientation C-plane (0001) off angle toward M-Axis 0.35°± 0.15°
Orientation Flat (1-100) ± 0.5°, 16.0 ± 1.0 mm
Secondary Orientation Flat (11-20) ± 3°, 8.0 ± 1.0 mm
Total Thickness Variation ≤ 15 µm
BOW ≤ 20 µm
Conduction Type N-type
(Undoped)
N-type
(Ge-doped)
Semi-Insulating
(Fe-doped)
Resistivity(300K) < 0.5 Ω·cm < 0.05 Ω·cm >106 Ω·cm
Dislocation Density 1~9x105 cm-2 5x105 cm-2
~3x106 cm-2
1~9x105 cm-2
1~3x106 cm-2 1~3x106 cm-2
Polishing Front Surface: Ra < 0.2 nm. Epi-ready polished
Back Surface: Fine ground
Package Packaged in a class 100 clean room environment, in single wafer containers, under a nitrogen atmosphere.

4inch specification
Item GaN-T-C-U-C100 GaN-T-C-N-C100
Dimensions Ф 100 mm ± 0.1 mm
Thickness 4 µm, 20 µm
Orientation C-plane(0001) ± 0.5°
Conduction Type N-type
(Undoped)
N-type
(Si-doped)
Resistivity 300K < 0.5 Ω·cm < 0.05 Ω·cm
Carrier Concentration < 5x1017 cm-3 > 1x1018 cm-3
Mobility ~ 300cm2/V·s ~ 200 cm2/V·s
Dislocation Density Less than 5x108 cm-2
Substrate structure GaN on Sapphire(Standard: SSP Option: DSP)
Useable Surface Area > 90%
Package Packaged in a class 100 clean room environment, in cassettes of 25pcs or single wafer containers, under a nitrogen atmosphere.

6. Product pictures
GaN Template Wafers Substrate for High-Power DeviceGaN Template Wafers Substrate for High-Power Device


GaN Template Wafers Substrate for High-Power Device

 

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