Semiconductor Application Monocrystalline 4inch Fz Silicon

Product Details
Growth Method: CZ and Fz
Orientation: 111 or 100
Resistivity: 0.0005 to 150
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  • Semiconductor Application Monocrystalline 4inch Fz Silicon
  • Semiconductor Application Monocrystalline 4inch Fz Silicon
  • Semiconductor Application Monocrystalline 4inch Fz Silicon
  • Semiconductor Application Monocrystalline 4inch Fz Silicon
  • Semiconductor Application Monocrystalline 4inch Fz Silicon
  • Semiconductor Application Monocrystalline 4inch Fz Silicon
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  • Overview
  • Detailed Photos
  • Related products we can supply
  • processing
  • Equipments
  • Product Parameters
Overview

Basic Info.

Model NO.
FW-Silicon
Surface
Double Side Polished or Single Side Polished
Dopant
N Type and P Type
Particles
<30 at 0.3um
Bow
< 30 Um
Ttv
<15 Um
Transport Package
Box
Specification
customized
Trademark
Finewin
Origin
Jiaozuo Henan
Production Capacity
100, 000PCS/Month

Packaging & Delivery

Package Size
40.00cm * 55.00cm * 20.00cm
Package Gross Weight
3.000kg

Product Description

1. what is Oxide silicon wafers and it's application:

The silicon thermal dioxide wafer refers to the thermal growth of a uniform dielectric film on the surface of the silicon wafer, which is used as an insulation or mask material. The oxidation process includes high temperature dry oxygen oxidation and high temperature wet oxygen oxidation.

Silicon wafer is the most common material and widely used for a varity of high-tech industries, including integrated circuits, detector or sensor device, MEMS fabrication, opto-electronic components, and solar cells.

Silicon wafer is a very thin round disk cut from high-purity silicon. A round silicon ingot is sliced to thicknesses of approximately 1mm. The surfaces of the resulting disk are polished carefully, then it is cleaned, resulting in the completed wafer. Silicon wafers are made from high-purity silicon, and are the material of semiconductor devices. These wafers can also be fabricated with a SEMI notch or one or two SEMI flats. 
Detailed Photos

Semiconductor Application Monocrystalline 4inch Fz SiliconSemiconductor Application Monocrystalline 4inch Fz Silicon
Related products we can supply

Semiconductor Application Monocrystalline 4inch Fz SiliconSemiconductor Application Monocrystalline 4inch Fz Silicon

processing

 Manufacturing a Silicon Wafer
Growing a silicon ingot can take anywhere from one week to one month, depending on many factors, including size, quality and the specification. More than 75% of all single crystal silicon wafers grow via the Czochralski (CZ) method. 

Semiconductor Application Monocrystalline 4inch Fz Silicon

Equipments


Semiconductor Application Monocrystalline 4inch Fz Silicon

Product Parameters
 
Grow method CZ or FZ
Diameter 1 to 8 inch
Finish As cut, lapped, etched, SSP, DSP
Orientation (100) (111) (110)
Type N or P
Resistivity CZ: From 0.0005 to 150 Ωcm
FZ: Up to 10 kΩcm

 

 

5.FAQ:

Q: What's the way of shipping and cost?

A:(1) We accept DHL, Fedex, TNT, UPS, EMS etc.

   (2) If you have your own express account, it's great.If not,we could help you ship them. 

 Q: How to pay?

A: T/T, Paypal, etc

Q: What's your MOQ?

A:  (1) For inventory, the MOQ is 5pcs.

   (2) For customized products, the MOQ is 10pcs-25pcs.

Q: What's the delivery time?

A:  (1) For the standard products

          For inventory: the delivery is 5 workdays after you place the order.

          For customized products: the delivery is 2 or 3 weeks after you place the order.

     (2) For the special-shaped products, the delivery is 4 or 6 workweeks after you place the order.

Q: Do you have standard products?

A: Our standard products in stock.

Q: Can I customize the products based on my need?

A: Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.
 



 

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